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[ Company Profile ]
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Telephus Inc. is a venture corporation that develops, manufactures, and markets wireless telecommunication components with its own design capability and innovative smart substrate technology. The value of Telephus products is its breakthrough, patented manufacturing technology for smart silicon substrates, which creates demonstrable customer benefits in term of cost, function, and product reliability.
For instance, with a new concept of RF IC design (called "TR-Array") spun off from smart substrate technology, Telephus has received an award from ECTC, US, 2000 (sponsored by Motorola). Smart Substrate Technology provides outstanding cost benefit by integrating numerous passive components of GaAs (or SiGe) RF IC into a silicon substrate without any sacrifice of electrical property.
In addition, for diversified product lines in the semiconductor component industry, Telephus has developed an innovative ACF (Antistrophic Conductive Film: Advanced Electronic Package Material) showing significant improvement of T/C (Thermal Cycle) reliability of flip chip on organic substrates with lower CTE and higher modulus of NCF layer.
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[ Selling Categories ]
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Other Telecommunications Products |
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Telecommunications |
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[ keyword ]
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 Registration Date |
2004/02/04 (Year/Month/Date) |
| Buyer / Seller in EC21 |
Seller |
| Business Type |
Manufacturer |
| Year established |
1995 |
| Employees total |
11 - 50 |
| Annual revenue |
USD 100,000 - 500,000 |
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| Contact Information |
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| Company |
Telephus Inc. |
| Address |
#25-11, Jang-dong Yuseong-gu Daejeon 305-343 Korea |
| Phone |
82 - 42 - 8661300 |
| Fax |
82 - 42 - 8661308 |
| Homepage |
www.telephus.com |
| Contact |
Ok-lan Park
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