|
|
| |
|
|
|
|

|

|
Click to enlarge image
|
Model Number |
TDL0918W302 |
Descriptions
Telephus' TDL0918W302 is a dual LPF (low pass filter) for GSM/AMPS, DCS/PCS or other 900 MHz and 1800MHz applications which is supplied as a bare die. The dual LPF has low insertion loss in pass band and high attenuation in harmonics. It is composed of 10 um Cu-plated inductors and Metal-Insulator-Metal capacitors, which are fabricated on Si Smart Substrate with 25 um thick oxide layer by Telephus' RFIPD (Integrated Passive Device) process. This product is very suitable for small-size modules for wireless hand-held or body-worn applications.
Features
- Passive Integration on Si Smart Substrate
- Low insertion loss in pass band
- High attenuation in harmonics
- Low VSWR
- Small size: 1.0mm x 1.2mm
- Low profile: 0.3mm typical
- Handles up to 3watts incident RF power
- Operating temperature: -40 to +85°C
- Storage temperature: -40 to +85°C
- Gold wire bonding compatible
- Applicable to MCM (Multi Chip Module)
- Packaged in reel, chip tray, or wafer
|
|
|
|
| |
|
|
|